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Molybdenum Copper
Coefficient of thermal expansion (CTE) of molybdenum copper can be tailored by adjusting the composition, which is the same way with tungsten copper composites. MoCu is much lighter than tungsten cooper, which make it more suitable for aerospace usage.
Properties for MoCu composites
| Composition | Mo wt% | Cu wt% | Density g/cm3 |
Thermal conductivity W/(M.K) |
CTE (10-6/K) |
| Mo85Cu15 | 85 ± 2 | Balance | 10 | 160 – 180 | 6.8 |
| Mo80Cu20 | 80 ± 2 | Balance | 9.9 | 170 – 190 | 7.7 |
| Mo70Cu30 | 70 ± 2 | Balance | 9.8 | 180 – 200 | 9.1 |
| Mo60Cu40 | 60 ± 2 | Balance | 9.66 | 210 – 250 | 10.3 |
| Mo50Cu50 | 50 ± 2 | Balance | 9.54 | 230 – 270 | 11.5 |
Application of molybdenum copper:
Heat Sinks and Spreaders
Microwave Carriers
Microelectronic Package Bases and Housings
Ceramic Substrate Carriers
Laser Diode Mounts
Surface Mount Package Conductors
Microprocessor Lids
Rocket Parts
Optical Packages
Power Packages
Butterfly Packages
Besides MoCu and (Tungsten copper) WCu heat sinks, we can also provide pure Moly, Cu-Mo-Cu Heat Sinks, Molybdenum-Copper-Molybdenum products, Cu-MoCu-Cu parts.
Cu-Mo-Cu (CMC materials) Heat Sinks Specification:
| Cu: Mo: Cu (Thick ratio) | Density (g/cc) | Coefficient of Thermal Expansion (10-6/K) | Thermal Conductivity (W/m·K), x-y direction | Thermal Conductivity (W/m·K), x-z direction |
|---|---|---|---|---|
| 1:1:1 | 9.4 | 9.4 | 300~310 | 240~250 |
| 1:2:1 | 9.6 | 7.7 | 260~270 | 210~220 |
| 1:3:1 | 9.7 | 6.9 | 230~240 | 190~200 |
| 1:4:1 | 9.8 | 6.2 | 210~220 | 170~180 |
| 13:74:13 | 9.9 | 5.8 | 190~200 | 160~170 |
Cu-Mo70Cu-Cu ( CPC material) Heat Sinks Specification:
|
Cu-Mo70Cu-Cu (Thick ratio) |
Density (g/cc) | Coefficient of Thermal Expansion (10-6/K) | Thermal Conductivity (W/m·K) | ||
| Plate direction | Thick direction | Plate direction | Thick direction | ||
| 1:4:1 | 9.46 | 7.2 | 9.0 | 250-300 | 210-250 |